Conductive Nonwoven Fabric Tape

Description

Product Introduction

The Conductive Nonwoven Fabric Tape is a specialty industrial adhesive tape designed for electronic and electrical applications requiring reliable conductivity, bonding and electromagnetic shielding. It uses metallized conductive nonwoven fabric as the substrate and is available in both single-sided and double-sided configurations.

One or both sides of the conductive nonwoven fabric can be coated with conductive acrylic pressure-sensitive adhesive and paired with a PET release liner. This construction provides XYZ three-dimensional omnidirectional conductivity while maintaining flexibility, conformability and adhesive performance.

The tape combines electrical conductivity with mechanical bonding and fixing functions. It can be used for electromagnetic interference (EMI) shielding, electrostatic discharge (ESD), equipment grounding and other EMC design requirements in electronic products.

Hangchen Technology provides conductive nonwoven fabric tape for electronic manufacturers and industrial users requiring conductive bonding and shielding materials.

Key Product Features

1. Three-Dimensional Omnidirectional Conductivity

The conductive nonwoven fabric construction supports conductivity in X, Y and Z directions. This XYZ three-dimensional conductive performance makes the tape suitable for applications where electrical contact is required across different surfaces and directions.

2. EMI Shielding Performance

The tape provides electromagnetic interference shielding performance from 30 MHz to 10 GHz. Its shielding effectiveness is specified at ≥70 dB, making it suitable for EMC-related applications in electronic products.

3. Conductive Bonding

Conductive acrylic pressure-sensitive adhesive provides both bonding and electrical conductivity. This allows the tape to combine fixing and conductive connection functions in a single adhesive material.

4. ESD and Grounding Functions

The conductive structure can be used for electrostatic discharge and equipment grounding applications. It is suitable for electronic assemblies where controlled electrical contact is required.

5. Flexible and Conformable

The nonwoven fabric substrate provides strong flexibility and conformability. The tape can adapt to different surfaces and component structures while maintaining adhesive contact.

6. Good Temperature Resistance

The conductive tape offers temperature resistance suitable for industrial electronic applications. It is designed to maintain its functional properties under applicable operating conditions.

7. Strong Adhesion and Holding Power

The product provides an adhesion value of ≥1100 gf/25mm and holding power of ≥24 hours according to the supplied technical specifications.

8. Single-Sided and Double-Sided Options

The conductive nonwoven fabric tape is available in single-sided and double-sided versions. Users can select the appropriate construction according to bonding, conductivity and assembly requirements.

9. Environmental Compliance

The product complies with relevant environmental requirements, including halogen requirements, EU RoHS and REACH, supporting its use in electronic product manufacturing and EMC design.

Technical Specifications

Item	Specification
Product Name	Conductive Nonwoven Fabric Tape
Tape Type	Single-sided / Double-sided
Substrate	Metallized conductive nonwoven fabric
Adhesive	Conductive acrylic pressure-sensitive adhesive
Release Liner	PET
Thickness	0.03–0.12 mm
X-Y Resistance	≤0.1 Ω/in²
Z-Axis Resistance	≤0.05 Ω/in²
Adhesion	≥1100 gf/25mm
Holding Power	≥24 hours
Shielding Effectiveness	≥70 dB
Shielding Frequency Range	30 MHz–10 GHz
Main Functions	Conductive bonding, EMI shielding, ESD and grounding

Conductive Structure

The tape uses metallized conductive nonwoven fabric as its primary substrate. Conductive acrylic pressure-sensitive adhesive is applied to one or both sides depending on the product configuration.

The combination of conductive substrate and conductive adhesive enables the tape to provide both electrical and mechanical functions. The PET release liner helps protect the adhesive surface before application.

This construction makes the material suitable for assemblies where conventional non-conductive adhesive tape cannot provide the required electrical connection or shielding function.

Electrical Performance

The tape provides low electrical resistance in both horizontal and vertical directions.

• X-Y Resistance: ≤0.1 Ω/in²

• Z-Axis Resistance: ≤0.05 Ω/in²

The low resistance values support electrical continuity across the bonded area and are suitable for conductive connection, grounding and EMC applications.

The XYZ conductive structure is particularly useful where conductivity needs to be maintained across multiple contact directions rather than only along the plane of the tape.

EMI Shielding Performance

The conductive nonwoven fabric tape provides shielding effectiveness of ≥70 dB from 30 MHz to 10 GHz according to the supplied specifications.

This shielding performance allows the tape to be incorporated into EMC designs for electronic products where electromagnetic interference needs to be controlled.

The actual shielding result in a finished assembly may depend on surface condition, overlap, grounding design, contact pressure, joint structure and installation method.

Adhesion and Holding Performance

The conductive acrylic pressure-sensitive adhesive provides reliable bonding while maintaining conductive contact.

The specified performance includes:

• Adhesion: ≥1100 gf/25mm

• Holding power: ≥24 hours

These properties allow the tape to perform both as a conductive interface and as a fixing material in electronic assemblies.

Application Areas

The Conductive Nonwoven Fabric Tape is widely used in EMC design for various electronic products.

Typical application functions include:

EMI Shielding

Used to support electromagnetic interference control in electronic assemblies and equipment.

ESD Protection

Can be incorporated into designs requiring electrostatic discharge management and conductive paths.

Equipment Grounding

Suitable for conductive grounding applications where reliable electrical contact between components or surfaces is required.

Conductive Bonding

Can replace separate conductive connection and bonding processes in suitable assembly designs, helping combine mechanical fixing with electrical conductivity.

Electronic Product EMC Design

Suitable for electronic manufacturers and component assemblers developing EMC solutions for electronic equipment.

Advantages for Electronic Assembly

Requirement	Tape Function
Electrical connection	XYZ three-dimensional conductivity
EMI control	Shielding effectiveness ≥70 dB
ESD management	Conductive structure supports ESD applications
Grounding	Conductive adhesive and substrate
Component fixing	Pressure-sensitive adhesive bonding
Surface conformity	Flexible nonwoven fabric construction
Thin assembly	0.03–0.12 mm thickness options
Product compliance	Halogen requirements, RoHS and REACH

Available Configurations

The product is available in:

Single-Sided Conductive Nonwoven Fabric Tape

Conductive adhesive is applied to one side of the conductive substrate. This configuration can be selected for applications requiring conductive bonding or shielding contact from one adhesive surface.

Double-Sided Conductive Nonwoven Fabric Tape

Conductive adhesive is applied to both sides of the substrate. This configuration can be used where conductive bonding or electrical contact is required on both sides of the tape.

The appropriate configuration should be selected according to the assembly structure and required electrical contact path.

Environmental Compliance

The conductive nonwoven fabric tape complies with relevant environmental requirements specified for the product, including:

• Halogen requirements

• EU RoHS

• REACH

These characteristics make the tape suitable for electronic manufacturing environments where material compliance is part of product selection.

Selection and Application Considerations

Before selecting the tape, buyers should evaluate the required thickness, single-sided or double-sided construction, bonding surface, conductivity requirements and shielding requirements.

For EMC applications, the final shielding performance depends not only on the tape itself but also on the complete equipment structure. Proper surface preparation, electrical contact, grounding design and tape application are important for achieving consistent performance.

For production applications, users should verify compatibility with the substrate, adhesive surface and assembly process before mass production.

B2B Supply Information

Hangchen Technology supplies conductive nonwoven fabric tape for electronic manufacturing, EMC design and industrial adhesive applications.

The product is available in thicknesses from 0.03 to 0.12 mm, with single-sided and double-sided options. Its combination of conductivity, adhesion, flexibility and EMI shielding makes it suitable for electronic product assembly and electrical connection applications.

For bulk procurement or customized application requirements, buyers can specify the required tape structure, thickness, adhesive configuration and application conditions when requesting product information.

Product Summary

Combining conductive nonwoven fabric, conductive acrylic adhesive and PET release liner, Conductive Nonwoven Fabric Tape provides electrical conductivity, adhesive bonding, EMI shielding, ESD and grounding functions in a thin and flexible format.

It is designed for EMC applications in electronic products and can be supplied in single-sided or double-sided configurations according to assembly requirements.

For conductive adhesive tape procurement and electronic EMC applications, buyers can contact Hangchen Technology for product specifications and application information.

Conductive Nonwoven Fabric Tape offers a practical combination of conductivity, shielding and bonding for electronic product EMC design.